Patent Assignment
Reel/Frame 067490/0783
Assignment of Assignor's Interest
Recorded: 2024-05-22
Pages: 3
Assignors
HABA, BELGACEM
Executed: 2024-03-12
UZOH, CYPRIAN EMEKA
Executed: 2024-03-12
KATKAR, RAJESH
Executed: 2024-03-12
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Cooling Assembly Including Coolant Channel on the Backside Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.