Patent Assignment
Reel/Frame 067490/0789
Assignment of Assignor's Interest
Recorded: 2024-05-22
Pages: 3
Assignor
HABA, BELGACEM
Executed: 2024-05-21
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
Embedded Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Application:
63/435,921 →
Embedded Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.