IP Library › Assignment 067501/0369
Patent Assignment
Reel/Frame 067501/0369

Change of Address

Recorded: 2024-05-22 Pages: 11
Assignor
RESONAC CORPORATION
Executed: 2023-10-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Properties (2)
SiC SUBSTRATE AND SiC INGOT
Application: 18/442,077 →
Publication: US US20240183072A1
Ferroelectric Storage Apparatus and Manufacturing Method of Conductive Probe
Application: 18/636,662 →
Publication: US US20240282338A1
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 16, 2024
From: YANAGISAWA, MASAAKI
To: SHOWA DENKO K.K.
Reel/Frame 067118/0608 →
Declaration of Succession Apr 23, 2024
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 067201/0856 →
Assignment of Assignor's Interest Oct 15, 2024
From: RESONAC CORPORATION
To: RESONAC HARD DISK CORPORATION
Reel/Frame 069167/0673 →