Patent Assignment
Reel/Frame 067521/0411
Assignment of Assignor's Interest
Recorded: 2024-05-24
Pages: 3
Assignors
RAFALOWSKI, ARKADIUSZ
Executed: 2024-05-24
DURALEK, JANUSZ
Executed: 2024-05-24
HEBDA, PAWEL
Executed: 2024-05-23
Assignee
APTIV TECHNOLOGIES AG
PESTALOZZISTRASSE 2, SCHAFFHAUSEN, 8200, SWITZERLAND
Covered Property
(1)
PCB Housing and Assembly Method Therefor
Application:
18/668,594 →
Publication:
US 2025/0203798