Patent Assignment
Reel/Frame 067522/0200
Assignment of Assignor's Interest
Recorded: 2024-05-24
Pages: 3
Assignors
CHANG, MENG-SHENG
Executed: 2021-09-08
HUANG, CHIA-EN
Executed: 2021-09-08
WANG, YIH
Executed: 2021-09-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Mim Memory Cell with Backside Interconnect Structures
Application:
18/670,472 →
Publication:
US 2024/0315014