Patent Assignment
Reel/Frame 067522/0624
Assignment of Assignor's Interest
Recorded: 2024-05-24
Pages: 7
Assignors
LI, WENLIANG
Executed: 2024-05-24
WANG, ZEWEN
Executed: 2023-08-18
LIU, XUSHENG
Executed: 2023-08-17
XIE, ERTANG
Executed: 2023-05-23
YAN, ZHONG
Executed: 2023-08-18
XIONG, WANG
Executed: 2023-08-18
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA
Covered Property
(1)
Printed Circuit Board, Communications Device, and Manufacturing Method