Patent Assignment
Reel/Frame 067529/0867
Assignment of Assignor's Interest
Recorded: 2024-05-27
Pages: 4
Assignors
KUANG, SHIN-JIUN
Executed: 2021-05-10
LIN, MENG-YU
Executed: 2021-05-10
WU, CHUNG-WEI
Executed: 2021-05-23
CHENG, CHUN-FU
Executed: 2021-05-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Fabrication Thereof