Patent Assignment
Reel/Frame 067547/0762
Assignment of Assignor's Interest
Recorded: 2024-05-29
Pages: 7
Assignors
PARK, JIN DUCK
Executed: 2024-05-14
KWON, CHAN-SIK
Executed: 2024-05-14
KIM, YONG-SEONG
Executed: 2024-05-14
IM, IN WOOK
Executed: 2024-05-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Semiconductor Package Including the Same
Application:
18/676,696 →
Publication:
US 2025/0168984