IP Library Assignment 067547/0762
Patent Assignment
Reel/Frame 067547/0762

Assignment of Assignor's Interest

Recorded: 2024-05-29 Pages: 7
Assignors
PARK, JIN DUCK
Executed: 2024-05-14
KWON, CHAN-SIK
Executed: 2024-05-14
KIM, YONG-SEONG
Executed: 2024-05-14
IM, IN WOOK
Executed: 2024-05-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Printed Circuit Board and Semiconductor Package Including the Same
Application: 18/676,696 →
Publication: US 2025/0168984