Assignment of Assignor's Interest

Recorded: 2024-05-31 Pages: 4

Assignor

RENARD, LOIC PIERRE LOUIS

Executed: 2023-07-03

Assignee

STMICROELECTRONICS PTE LTD.

28 ANG MO KIO IND PARK 2, SINGAPORE, 569508, SINGAPORE

Covered Property (1)

Semiconductor Packaging with Embedded Emf Shielding Protection Using Wire Bonding

Application: 18/680,178 →

Publication: US 2024/0421055

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.