Assignment of Assignor's Interest

Recorded: 2024-06-04 Pages: 4

Assignor

LOO, SHEI MENG

Executed: 2024-05-29

Assignee

STMICROELECTRONICS PTE LTD

28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE

Covered Property (1)

Multi-Axis Laser Drilling for Wafer-Level Packaging

Application: 18/733,373 →

Publication: US 2024/0429095

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.