Patent Assignment
Reel/Frame 067656/0721
Assignment of Assignor's Interest
Recorded: 2024-06-07
Pages: 5
Assignors
SAVANT, CHANDRASHEKHAR PRAKASH
Executed: 2020-06-17
TSAI, CHIA-MING
Executed: 2020-06-17
FAN, YUH-TA
Executed: 2020-06-17
YU, TIEN-WEI
Executed: 2020-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Trench Isolation with Conductive Structures
Application:
18/736,998 →
Publication:
US 2024/0395629