Patent Assignment
Reel/Frame 067718/0937
Assignment of Assignor's Interest
Recorded: 2024-06-13
Pages: 4
Assignors
YUN, HAN SOL
Executed: 2024-05-08
BAE, SUNG CHUL
Executed: 2024-05-08
YU, JI HYUN
Executed: 2024-05-08
KANG, SUNG HYUNG
Executed: 2024-05-08
KIM, HYE WON
Executed: 2024-05-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component with Improved Cover and Margin Portions
Application:
18/742,308 →
Publication:
US 2025/0087423