Patent Assignment
Reel/Frame 067721/0212
Assignment of Assignor's Interest
Recorded: 2024-06-13
Pages: 3
Assignor
MAO, YANDONG
Executed: 2024-05-07
Assignee
STMICROELECTRONICS (CHINA) INVESTMENT CO., LTD.
FOURTH FLOOR, DING BUILDING, NO. 555, DONGCHUAN ROAD, SHANGHAI, 200241, CHINA
Covered Property
(1)
Optical Package Comprising a Cap and a Support Substrate Connected Together
Application:
18/734,573 →
Publication:
US 2024/0421176
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 13, 2024
From: PERMINJAT, FLORIAN; BEIX, VINCENT; SAXOD, KARINE
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 067721/0234 →
Assignment of Assignor's Interest
Oct 17, 2024
From: STMICROELECTRONICS (CHINA) INVESTMENT CO., LTD.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068925/0970 →
Assignment of Assignor's Interest
Nov 7, 2024
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 069186/0895 →