IP Library › Assignment 068925/0970
Patent Assignment
Reel/Frame 068925/0970

Assignment of Assignor's Interest

Recorded: 2024-10-17 Pages: 6
Assignor
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties (3)
Optical Package Comprising a Cap and a Support Substrate Connected Together
Application: 18/734,573 →
Publication: US 2024/0421176
Optical Component with Conductive Trace, Associated Optical Module, and Associated Method
Application: 18/746,712 →
Publication: US 2025/0383517
Systems and Methods for Locating Tag Positions Using a Single-Chip
Application: 18/790,046 →
Publication: US 2026/0037755
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 13, 2024
From: MAO, YANDONG
To: STMICROELECTRONICS (CHINA) INVESTMENT CO., LTD.
Reel/Frame 067721/0212 →
Assignment of Assignor's Interest Jun 13, 2024
From: PERMINJAT, FLORIAN; BEIX, VINCENT; SAXOD, KARINE
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 067721/0234 →
Assignment of Assignor's Interest Jun 18, 2024
From: JOHNSON, BRANDON SCOTT; WILLIAMS, FRASER; CROCHERIE, AXEL
To: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
Reel/Frame 067759/0076 →
Assignment of Assignor's Interest Jun 18, 2024
From: MAO, YANDONG
To: STMICROELECTRONICS (CHINA) INVESTMENT CO., LTD.
Reel/Frame 067759/0306 →
Assignment of Assignor's Interest Jul 31, 2024
From: TIAN, DONGYANG; ZHANG, RUI
To: STMICROELECTRONICS (CHINA) INVESTMENT CO., LTD.
Reel/Frame 068144/0327 →
Assignment of Assignor's Interest Oct 17, 2024
From: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068926/0100 →
Assignment of Assignor's Interest Nov 7, 2024
From: STMICROELECTRONICS (GRENOBLE 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 069186/0895 →