Patent Assignment
Reel/Frame 067749/0346
Assignment of Assignor's Interest
Recorded: 2024-06-17
Pages: 4
Assignors
WU, CHIEH-HAN
Executed: 2019-10-21
TSAI, CHENG-HSIUNG
Executed: 2019-10-21
LU, CHIH WEI
Executed: 2019-10-21
LEE, CHUNG-JU
Executed: 2019-10-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Self-Aligned via for Interconnect Structure