Patent Assignment
Reel/Frame 067757/0488
Assignment of Assignor's Interest
Recorded: 2024-06-18
Pages: 7
Assignors
HABA, BELGACEM
Executed: 2020-04-01
DELACRUZ, JAVIER A.
Executed: 2020-04-01
KATKAR, RAJESH
Executed: 2020-04-01
SITARAM, ARKALGUD
Executed: 2020-04-02
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structure Including an Obstructive Element Directly Bonded to a Semiconductor Element Without an Adhesive
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Jun 18, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
Reel/Frame 067776/0389 →