IP Library › Assignment 067776/0389
Patent Assignment
Reel/Frame 067776/0389

Change of Name

Recorded: 2024-06-18 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Bonded Structure Including an Obstructive Element Directly Bonded to a Semiconductor Element Without an Adhesive
Application: 18/087,705 →
Publication: US 2023/0317628
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Jun 18, 2024
From: HABA, BELGACEM; DELACRUZ, JAVIER A.; KATKAR, RAJESH; SITARAM, ARKALGUD
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 067757/0488 →