Patent Assignment
Reel/Frame 067799/0245
Assignment of Assignor's Interest
Recorded: 2024-06-21
Pages: 4
Assignors
JANG, KYUNGSOO
Executed: 2024-06-11
KIM, YONGWOON
Executed: 2024-06-11
LEE, SANGWON
Executed: 2024-06-11
PARK, EUNSOO
Executed: 2024-06-11
AN, JINWAN
Executed: 2024-06-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Heat Dissipation Structure Providing Heat Transfer Path
Application:
18/750,244 →
Publication:
US 2025/0089215