Patent Assignment
Reel/Frame 067813/0567
Assignment of Assignor's Interest
Recorded: 2024-06-24
Pages: 5
Assignors
YEH, SHU-SHEN
Executed: 2020-11-27
YANG, CHE-CHIA
Executed: 2020-12-18
LIN, YU-SHENG
Executed: 2020-11-27
WANG, CHIN-HUA
Executed: 2020-11-29
LIN, PO-YAO
Executed: 2020-11-27
JENG, SHIN-PUU
Executed: 2020-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure with Lid