Patent Assignment
Reel/Frame 067848/0508
Assignment of Assignor's Interest
Recorded: 2024-06-26
Pages: 6
Assignor
RADISURF APS
Executed: 2024-06-26
Assignee
RADISURF, INC.
20400 STEVENS CREEK BLVD., SUITE 800, CUPERTINO, CALIFORNIA, 95014
Covered Properties
(2)
Micron-Scale Surface Polymers on Substrate Surfaces and Methods of Forming the Same
Application:
63/651,781 →
Electroless Deposition of Metal on Polymer Brush Films on Substrate Surfaces
Application:
63/653,138 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2024
From: KARIM, M ZIAUL
To: YIELD ENGINEERING SYSTEMS, INC.
Reel/Frame 067800/0477 →
Assignment of Assignor's Interest
Jun 21, 2024
From: BAJAJ, RAJEEV; NARAYANAN, PURNIMA
To: YIELD ENGINEERING SYSTEMS, INC.
Reel/Frame 067801/0332 →
Assignment of Assignor's Interest
Jun 25, 2024
From: NIKOLAJSEN, JAKOB PAGH; AGERGAARD, ASGER HOLM; MANDAL, JOYDEB; LILLETHORUP, MIE BLOM
To: RADISURF APS
Reel/Frame 067833/0374 →
Assignment of Assignor's Interest
Jun 25, 2024
From: JESSEN, NICOLAJ INUNNGUAQ; AGERGAARD, ASGER HOLM; NIKOLAJSEN, JAKOB PAGH; MANDAL, JOYDEB
To: RADISURF APS
Reel/Frame 067833/0395 →
Assignment of Assignor's Interest
Jun 26, 2024
From: ROGOJINA, ELENA V.; KWAK, BYUNG SUNG
To: RADISURF, INC.
Reel/Frame 067840/0161 →
Assignment of Assignor's Interest
Jun 27, 2024
From: KWAK, BYUNG SUNG
To: RADISURF, INC.
Reel/Frame 067855/0575 →
Merger and Change of Name
Mar 18, 2026
From: RADISURF, INC.; YIELD ENGINEERING SYSTEMS, INC.
To: YIELD ENGINEERING SYSTEMS, INC.
Reel/Frame 074109/0411 →