Patent Assignment
Reel/Frame 067877/0492
Assignment of Assignor's Interest
Recorded: 2024-06-26
Pages: 3
Assignors
LEE, BYUNG HUN
Executed: 2024-06-14
CHOI, SANG WON
Executed: 2024-06-17
KOO, KUN HOI
Executed: 2024-06-17
LEE, HO-JAE
Executed: 2024-06-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayered Electronic Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.