Patent Assignment
Reel/Frame 067891/0128
Assignment of Assignor's Interest
Recorded: 2024-07-02
Pages: 8
Assignors
LIANG, CHIN-WEI
Executed: 2020-06-16
CHEN, SHENG-CHAU
Executed: 2020-07-06
KUANG, HSUN-CHUNG
Executed: 2020-06-20
LI, SHENG-CHAN
Executed: 2020-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bond Pad Structure for Bonding Improvement