Patent Assignment
Reel/Frame 067900/0201
Assignment of Assignor's Interest
Recorded: 2024-07-02
Pages: 7
Assignors
PARK, JAE HYUN
Executed: 2024-06-10
BAEK, DONG WOO
Executed: 2024-06-10
CHA, HYEUNG JOON
Executed: 2024-06-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Power Management Integrated Circuit and Memory Module Includng the Same
Application:
18/748,051 →
Publication:
US 2025/0166692