Patent Assignment
Reel/Frame 067900/0218
Assignment of Assignor's Interest
Recorded: 2024-07-02
Pages: 6
Assignors
XU, WEIHAO
Executed: 2024-06-20
MALETZKY, TOBIAS
Executed: 2024-06-20
TANEMURA, SHIGEKI
Executed: 2024-06-20
FUJII, KEN
Executed: 2024-06-20
HU, WEISHENG
Executed: 2024-06-20
Assignee
HEADWAY TECHNOLOGIES, INC.
682 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Hybrid Plasmonic Bottom Layer For Increased Near Field Transducer Reliability
Patent:
12,354,628 →
Application:
18/587,570 →