Patent Assignment
Reel/Frame 067951/0302
Assignment of Assignor's Interest
Recorded: 2024-07-10
Pages: 3
Assignors
HU, CHIH-HSIUNG
Executed: 2023-08-25
LEE, CHUN-TE
Executed: 2023-08-25
GUO, SHYH-JEN
Executed: 2023-08-25
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO. 3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Flexible Circuit Tape and Flexible Circuit Board Thereof
Application:
18/768,605 →
Publication:
US 2025/0071895