Patent Assignment
Reel/Frame 068006/0132
Assignment of Assignor's Interest
Recorded: 2024-07-17
Pages: 4
Assignors
CHU, CHIA-HUNG
Executed: 2020-09-10
SHIH, DING-KANG
Executed: 2020-10-05
LIN, KENG-CHU
Executed: 2020-09-20
TSAI, PANG-YEN
Executed: 2020-10-05
WANG, SUNG-LI
Executed: 2020-09-10
LIANG, SHUEN-SHIN
Executed: 2020-09-10
HUNG, TSUNGYU
Executed: 2020-10-05
CHANG, HSU-KAI
Executed: 2020-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Backside Contact Structures for Semiconductor Devices
Application:
18/770,393 →
Publication:
US 2024/0371952