Patent Assignment
Reel/Frame 068034/0162
Assignment of Assignor's Interest
Recorded: 2024-07-19
Pages: 3
Assignors
WU, TSE-HSIEN
Executed: 2023-12-14
NI, CHYI-TSONG
Executed: 2023-12-11
CHIANG, CHE-YU
Executed: 2023-12-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Immersion Cooling Fin Assembly and Immersion Cooling System for Two-Phase Immersion Cooling