Patent Assignment
Reel/Frame 068088/0877
Assignment of Assignor's Interest
Recorded: 2024-07-25
Pages: 3
Assignors
PARK, SUN KYOUNG
Executed: 2024-06-05
LEE, CHAE DONG
Executed: 2024-06-05
HWANG, JUNG WUN
Executed: 2024-06-05
KIM, WI HUN
Executed: 2024-06-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component
Application:
18/784,101 →
Publication:
US 2025/0079087