Patent Assignment
Reel/Frame 068111/0360
Assignment of Assignor's Interest
Recorded: 2024-07-29
Pages: 3
Assignor
NITTO DENKO CORPORATION
Executed: 2024-07-17
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.