IP Library › Assignment 064463/0170
Patent Assignment
Reel/Frame 064463/0170

Assignment of Assignor's Interest

Recorded: 2023-08-02 Pages: 4
Assignor
NITTO DENKO CORPORATION
Executed: 2023-07-18
Assignees
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-0041, JAPAN
Covered Properties (2)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 7,501,711 →
Application: 11/665,967 →
Publication: US 2008/0136048
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 8,729,715 →
Application: 13/556,646 →
Publication: US 2013/0026662
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 24, 2012
From: IWASHIGE, TOMOHITO; ICHIKAWA, TOMOAKI; FUSUMADA, MITSUAKI; SUGIMOTO, NAOYA
To: NITTO DENKO CORPORATION
Reel/Frame 028624/0870 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
Assignment of Assignor's Interest Jul 29, 2024
From: NITTO DENKO CORPORATION
To: RESONAC CORPORATION
Reel/Frame 068111/0360 →