IP Library › Assignment 028624/0870
Patent Assignment
Reel/Frame 028624/0870

Assignment of Assignor's Interest

Recorded: 2012-07-24 Pages: 2
Assignors
IWASHIGE, TOMOHITO
Executed: 2012-07-19
ICHIKAWA, TOMOAKI
Executed: 2012-07-19
FUSUMADA, MITSUAKI
Executed: 2012-07-19
SUGIMOTO, NAOYA
Executed: 2012-07-19
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, JAPAN
Covered Property (1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 8,729,715 →
Application: 13/556,646 →
Publication: US 2013/0026662
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2023
From: NITTO DENKO CORPORATION
To: RESONAC CORPORATION; NITTO DENKO CORPORATION
Reel/Frame 064463/0170 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →