Epoxy resin composition for semiconductor encapsulation
View Patent ↗The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.
1. An epoxy resin composition for semiconductor encapsulation, comprising the following components (A) to (D):
(A) an epoxy resin;
(B) a phenol resin;
(C) an inorganic filler; and
(D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30,
wherein the silicone compound as the component (D) is contained in an amount of 0.5 to 5.0 wt % based on the entire epoxy resin composition.
2. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the inorganic filler as the component (C) is contained in an amount of 70 to 92 wt % based on the entire epoxy resin composition.
3. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the alkoxy group in the silicone compound as the component (D) contains at least a methoxy group.
4. The epoxy resin composition for semiconductor encapsulation according to claim 1 , wherein the silicone compound as the component (D) has an organic substituent, and the organic substituent contains a phenyl group.
5. A semiconductor device obtained by resin-encapsulating a semiconductor element with the epoxy resin composition for semiconductor encapsulation according to claim 1 .
6. The semiconductor device according to claim 5 , which is a single-sided resin encapsulation-type package.