Patent Assignment
Reel/Frame 068144/0453
Assignment of Assignor's Interest
Recorded: 2024-07-31
Pages: 4
Assignors
CIHANG, YUEH
Executed: 2023-04-19
CHIU, SHANG-HSUAN
Executed: 2023-04-19
LU, MING-XIANG
Executed: 2023-04-21
CHANG, KUANG-CHING
Executed: 2023-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same
Application:
18/791,112 →
Publication:
US 2024/0396536