Patent Assignment
Reel/Frame 068166/0829
Assignment of Assignor's Interest
Recorded: 2024-08-02
Pages: 3
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Assembly from Processed Substrate
Application:
18/780,892 →
Publication:
US 2025/0125196
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 2, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 068290/0364 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →