IP Library › Assignment 068290/0364
Patent Assignment
Reel/Frame 068290/0364

Change of Name

Recorded: 2024-08-02 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assembly from Processed Substrate
Application: 18/780,892 →
Publication: US 2025/0125196
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2024
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 068166/0829 →
Security Interest May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →