Patent Assignment
Reel/Frame 068179/0417
Assignment of Assignor's Interest
Recorded: 2024-08-05
Pages: 4
Assignors
SO, HYEJEONG
Executed: 2024-06-24
SEOL, CHANGKYU
Executed: 2024-06-24
KWAK, MYOUNGBO
Executed: 2024-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Using Multi-Level Signaling and Coding Method Thereof
Application:
18/793,395 →
Publication:
US 2025/0226917