Patent Assignment
Reel/Frame 068223/0423
Assignment of Assignor's Interest
Recorded: 2024-08-08
Pages: 5
Assignors
HATTORI, TAKASHI
Executed: 2024-04-19
YAMAUCHI, SHINICHI
Executed: 2024-04-19
ANAI, KEI
Executed: 2024-04-19
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Property
(1)
Method for Manufacturing Bonded Body and Method for Bonding Bodies to Be Bonded
Application:
18/836,850 →
Publication:
US 2025/0201764
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.