Patent Assignment
Reel/Frame 068267/0084
Assignment of Assignor's Interest
Recorded: 2024-08-13
Pages: 4
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Property
(1)
Copper Paste for Pressure Bonding, Semiconductor Device, Method for Preparing Copper Paste for Pressure Bonding, and Method for Manufacturing Semiconductor Device
Application:
18/838,020 →
Publication:
US 2025/0149492
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.