Assignment of Assignor's Interest

Recorded: 2024-08-23 Pages: 7

Assignors

SONG, YAO

Executed: 2024-07-24

HU, XINGGUO

Executed: 2024-07-30

SHI, DEFU

Executed: 2024-08-07

DU, HONGWEI

Executed: 2024-07-30

Assignee

HUAWEI TECHNOLOGIES CO., LTD.

HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG, 518129, CHINA

Covered Property (1)

Electronic Device and Method for Assembling Electronic Device

Application: 18/564,893 →

Publication: US 2024/0385651