Patent Assignment
Reel/Frame 068432/0338
Assignment of Assignor's Interest
Recorded: 2024-08-28
Pages: 5
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Interconnect Device and Method
Application:
18/818,216 →
Publication:
US 2024/0421098
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.