Assignment of Assignor's Interest

Recorded: 2024-08-28 Pages: 144

Assignor

INTEL CORPORATION

Executed: 2022-07-18

Assignee

TAHOE RESEARCH, LTD.

BLANCHARDSTOWN CORPORATE PARK 2, PLAZA 255, SUITE 2A, DUBLIN, D15 YH6H, IRELAND

Covered Property (1)

High Density Interconnect Device and Method

Application: 18/818,216 →

Publication: US 2024/0421098

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.