Patent Assignment
Reel/Frame 068454/0093
Assignment of Assignor's Interest
Recorded: 2024-08-30
Pages: 6
Assignors
KIM, JOHNSOO
Executed: 2024-08-29
OH, JOONGSUK
Executed: 2024-08-29
SEO, KANG-ILL
Executed: 2024-08-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Metal Lines Having Multi-Layer Structure
Application:
18/820,847 →
Publication:
US 2025/0308995