Patent Assignment
Reel/Frame 068552/0100
Assignment of Assignor's Interest
Recorded: 2024-09-11
Pages: 6
Assignors
KIM, KI-HEUNG
Executed: 2024-09-03
YOO, CHANGSIK
Executed: 2024-09-03
IHM, JEONGDON
Executed: 2024-09-03
HWANG, HYONGRYOL
Executed: 2024-09-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device and Memory Module Including the Same
Application:
18/818,007 →
Publication:
US 2025/0078906