Patent Assignment
Reel/Frame 068586/0031
Assignment of Assignor's Interest
Recorded: 2024-09-13
Pages: 4
Assignors
LEE, CHENG HUNG
Executed: 2024-04-14
HUANG, CHIEN-YU
Executed: 2024-04-07
HUANG, CHIA-EN
Executed: 2024-04-22
CHOU, YEN-CHI
Executed: 2024-04-07
HSU, SHAO HSUAN
Executed: 2024-04-07
LIN, TZU-CHUN
Executed: 2024-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device
Application:
18/493,553 →
Publication:
US 2025/0131959