Patent Assignment
Reel/Frame 068653/0956
Assignment of Assignor's Interest
Recorded: 2024-08-15
Pages: 3
Assignors
CHENG, YUN-WEI
Executed: 2019-05-08
CHUN-WEI, CHIA
Executed: 2019-05-08
CHOU, CHUN-HAO
Executed: 2019-05-08
LEE, KUO-CHENG
Executed: 2019-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacture
Application:
18/769,709 →
Publication:
US 2024/0373145