Patent Assignment
Reel/Frame 068696/0505
Assignment of Assignor's Interest
Recorded: 2024-09-25
Pages: 4
Assignor
WANG, XUEWEN
Executed: 2024-09-25
Assignee
KLA CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
System and Method for Wafer Shape Pairing for Improved Post-Bonding Performance
Application:
18/797,715 →