Patent Assignment
Reel/Frame 068697/0319
Assignment of Assignor's Interest
Recorded: 2024-09-25
Pages: 9
Assignors
YONEDA, YOSHIHIRO
Executed: 2024-09-09
HOSOI, TOSHIHIRO
Executed: 2024-09-09
FUKUDA, KENSHIRO
Executed: 2024-09-09
KAGEYAMA, YUJI
Executed: 2024-09-10
IIDA, HIROTO
Executed: 2024-09-11
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Method for Producing Printed Wiring Board with Built-in Capacitor and Multilayer Printed Wiring Board
Application:
18/850,834 →
Publication:
US 2025/0227856
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.