Patent Assignment
Reel/Frame 068914/0782
Assignment of Assignor's Interest
Recorded: 2024-10-16
Pages: 3
Assignors
HWANG, JUNG WUN
Executed: 2024-08-20
LEE, CHAE DONG
Executed: 2024-08-20
PARK, SUN KYOUNG
Executed: 2024-08-20
OH, JI HYE
Executed: 2024-08-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component
Application:
18/917,139 →
Publication:
US 2025/0166897