Patent Assignment
Reel/Frame 069079/0208
Assignment of Assignor's Interest
Recorded: 2024-10-30
Pages: 7
Assignors
CHOI, JAEMYUNG
Executed: 2024-10-23
KIM, JOHNSOO
Executed: 2024-10-18
OH, JOONGSUK
Executed: 2024-10-26
SEO, KANG-ILL
Executed: 2024-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Interconnect Structure with Metal Jump Structure Connecting Adjacent Metal Lines
Application:
18/931,666 →