Patent Assignment
Reel/Frame 069204/0048
Assignment of Assignor's Interest
Recorded: 2024-11-11
Received: 2024-11-11
Pages: 3
Assignors
KRAMAN, MARK
Executed: 2024-11-06
LI, GUANGYUAN
Executed: 2024-11-06
TOYAMA, FUMIAKI
Executed: 2024-11-06
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
High Bandwidth Bonded Assembly with Through-Substrate via Structures Shielded by Guard Rings and Methods for Forming the Same
Application:
18/940,325 →